What is Cu clip package? 1 kg copper wire price

Power chips are linked to exterior circuits with packaging, and their performance depends upon the assistance of the product packaging. In high-power situations, power chips are generally packaged as power modules. Chip affiliation describes the electric link on the top surface of the chip, which is usually aluminum bonding cable in typical components. ^
Typical power component package cross-section

Currently, industrial silicon carbide power modules still mainly make use of the product packaging innovation of this wire-bonded traditional silicon IGBT module. They deal with troubles such as huge high-frequency parasitical criteria, inadequate heat dissipation capability, low-temperature resistance, and insufficient insulation stamina, which limit the use of silicon carbide semiconductors. The display screen of outstanding performance. In order to address these troubles and fully manipulate the huge potential benefits of silicon carbide chips, numerous brand-new product packaging innovations and options for silicon carbide power modules have arised recently.

Silicon carbide power component bonding method

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding products have established from gold cable bonding in 2001 to light weight aluminum cord (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have created from gold cords to copper cables, and the driving force is cost decrease; high-power devices have actually created from light weight aluminum cords (strips) to Cu Clips, and the driving pressure is to enhance product efficiency. The higher the power, the greater the requirements.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging process that uses a solid copper bridge soldered to solder to link chips and pins. Compared with conventional bonding product packaging techniques, Cu Clip technology has the complying with benefits:

1. The link between the chip and the pins is made of copper sheets, which, to a certain level, changes the typical cord bonding technique between the chip and the pins. As a result, a special package resistance worth, greater present circulation, and better thermal conductivity can be acquired.

2. The lead pin welding area does not require to be silver-plated, which can totally conserve the cost of silver plating and poor silver plating.

3. The item look is completely consistent with typical items and is mainly used in servers, portable computer systems, batteries/drives, graphics cards, electric motors, power supplies, and various other fields.

Cu Clip has 2 bonding methods.

All copper sheet bonding technique

Both eviction pad and the Resource pad are clip-based. This bonding method is extra costly and intricate, yet it can attain far better Rdson and much better thermal impacts.

( copper strip)

Copper sheet plus cord bonding technique

The source pad uses a Clip method, and eviction utilizes a Wire method. This bonding method is a little less expensive than the all-copper bonding approach, conserving wafer area (relevant to really tiny gateway locations). The procedure is simpler than the all-copper bonding method and can obtain better Rdson and much better thermal impact.

Distributor of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding 1 kg copper wire price, please feel free to contact us and send an inquiry.

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